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學(xué)習(xí)&新聞
Aerosemi(航天民芯)
High-speed and high-precision ADC and DAC chips/AC/DC converters, audio power amplifiers, LED TV special chips, etc.
2023-11-30
Aeroflex
PXI embedded controller, GPS simulator, RF frequency synthesizer, etc.
2023-11-30
Aeris
RF/IF and RFID
2023-11-30
AEM科技
ECU, chip inductors and magnetic beads, fuses, static suppressors, multilayer varistors
2023-11-30
AEL Crystals
Quartz crystals, oscillators, filters, surface acoustic wave devices, MEMS products, antennas, dielectric filters, etc.
2023-11-29
B&B Electronics
Ethernet and communication modules, RF/wireless modules, fuses, surge suppressors, D-Sub connectors
2023-11-29
B B Battery
Battery products
2023-11-29
Aearo Technologies
Fans, thermal management, hardware, fasteners, accessories application areas
2023-11-29
SK海力士計劃將下一代HBM采用2.5D扇出封裝技術(shù)
SK海力士正準(zhǔn)備推出“2.5D扇出”封裝，作為其下一代存儲半導(dǎo)體技術(shù)。SK海力士今年在高帶寬內(nèi)存（HBM）領(lǐng)域取得了成功，對下一代芯片技術(shù)領(lǐng)域充滿信心，似乎正在通過開發(fā)“專業(yè)”內(nèi)存產(chǎn)品來確保其技術(shù)領(lǐng)先地位。根據(jù)韓媒 Business Korea 報道，SK 海力士正準(zhǔn)備將 2.5D 扇出封裝技術(shù)集成到其繼 HBM 之后的下一代 DRAM 中。
2023-11-29
Advantech
Including software, hardware, system integration solutions for automation, embedded computers and intelligent services, as well as computer peripheral products such as memory, MCU, CPU, power supply, etc.
2023-11-28
Advanced Thermal Solutions(ATS)
Radiators, LED devices, transformers and other application fields
2023-11-28
Advanced Power Electronics(APEC)
MOSFETs, IGBTs and power ICs
2023-11-28
Advanced Linear Devices
Ultra-low power, high-precision CMOS analog integrated circuits, related board-level products and energy harvesting modules and accessories
2023-11-28
Advanced Interconnections
BGA socket systems, Peel-A-Way, board-to-board connectors, package converters, IC sockets and converters
2023-11-28
ADLINK Technology
USB data acquisition modules, PXI/PXIe and modular instruments, industrial-grade communication and remote control I/O, image capture cards/video capture cards, SEMA cloud, connectors, sensors
2023-11-28
ADEUNIS RF
Wireless modems, RF modules, etc
2023-11-28
三菱電機(jī)與安世合作開發(fā)SiC功率半導(dǎo)體
近日，日本三菱電機(jī)、安世半導(dǎo)體（Nexperia）宣布，將聯(lián)合開發(fā)高效的碳化硅（SiC）MOSFET分立產(chǎn)品功率半導(dǎo)體。三菱電機(jī)將研發(fā)、供應(yīng)SiC-MOSFET芯片給Nexperia，而Nexperia將研發(fā)搭載三菱電機(jī)芯片的SiC分離式組件（Discrete）。
2023-11-28
Adesto Technologies
Serial Flash and Conductive Bridge RAM (CBRAM) Memory
2023-11-27
ADC
FP optical communication components
2023-11-27
A-Data Technology
Memory, flash drive/flash card, SSD solid state drive and mobile hard drive
2023-11-27
