Product Description
High-power semiconductor refrigeration sheet TEC1-12708
| Chip type: | TEC1-12708 |
| Size: | 40*40*3.5mm±0.2 Component log: 127 |
| wire: | Tin plating on 300±8mm RV standard conductor with 5 mm lead length |
| Internal resistance: | 1.5~1.8Ω(ambient temperature 23±1℃, 1kHZ Ac test) |
| TD MAX: | Tmax(Qc=0)above 67℃ |
| Working current: | Imax=8A(rated voltage start-up) |
| Rated voltage: | DC12V(Vmax:15.5V) |
| Refrigeration power: | Qcmax 77W |
| Assembly pressure: | 85N/cm2 |
| Working environment: | Temperature range-55℃~83℃(excessive ambient temperature drop directly affects refrigeration efficiency) |
| Packaging process: | Surrounding Standard 704 Silicone Rubber Seal |
| Packaging standards: | Foam box packaging, storage conditions, ambient temperature-10℃~40℃ |
| Storage conditions: | -40~60℃ |
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