Product Advantages
? Double layer compact design
? Suitable for multiple soldering methods including wave soldering and reflow soldering
Product Specification
| Attribute | Attribute value |
| ANSM-Part# | ANSM-2EDGVHCM-5.08-04P |
| 包裝類型 Packaging type | 袋裝 In bags |
| 焊接方式 Welding method | 回流焊/波峰焊/手工焊 Reflow soldering/wave soldering/manual soldering |
| 額定電壓(B) Rated voltage (B) | 300V |
| 額定電流(B) Rated current (B) | 10A |
| 額定電壓 Rated voltage | 400V |
| 額定電涌電壓(II/2) Rated surge voltage (II/2) | 4KV |
| 安裝類型 Installation type | 焊板 Welding plate |
| 間距 Spacing | 5.08mm |
| 位數 Digit | 4 |
| 層數 Number of layers | 2 |
| 環(huán)保事項 Environmental issues | 符合 Compliant with REACH/RoHS |
| 接觸件材料 Contact material | 銅 Copper |
| 觸點區(qū)域金屬表面 Metal surface in contact area | 鍍錫 Tin-plating |
| 絕緣材料組 Insulation material group | Ⅲa |
| 阻燃等級 Flame retardant grade | UL94V-0 |
| 環(huán)境溫度（運行） Environmental temperature (operating) | -40℃~120℃(取決于降額曲線 Depending on the derating curve) |
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Company office environment
Warehouse Real Shot
Standard packaging
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